Microsphere Gold in Electronics

 


Scientists from Hefei Institutes of Physical Science of the Chinese Academy of Sciences have released a study to Nature Communications. They have efficiently constructed a gold microsphere array-based anisotropic conductive adhesive film (ACF). It is used in advanced packaging of electronics.

Scientists in the study designed a new method to create gold microsphere arrays within one minute. They used a positioned self assembly and laser irradiated ripening strategy. It works because of a rapid layer-by-layer melting and fusion process. This avoids the anisotropic growth theory.

There is a big advantage to this strategy. The size of the gold nanoparticles can be precisely controlled and also work with lithography techniques. The new technique is flexible. It can be used to make different types of microspheres. These include other alloy nanoparticles made from gold or other metals. When the microspheres are zapped with a laser, they fuse together. This creates durable and stable materials.

The new gold-plated microspheres are less prone to electrical problems under pressure. It could help LED chips and high-resolution displays in the future. 

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