Bubble Printing on Wire
A new study was published in Nanomaterials on October 17. Scientists at Yokohama National University have created a bubble printing technique. It allows for high precision patterning of liquid metal wiring in flexible electronics. The methodology offers new pathways for the creation of highly conductive circuits, that are both bendable and stretchable. These devices are ideal for wearable sensors and medical implants. Mainstream wiring is made of physical wiring and circuit boards. It powers most electronics, from phones to computers. There is a demand for wearable electronic devices, and it's proving that traditional wiring has inadequacies. Shoji Maruo is a professor at the Faculty of Engineering of Yokohama National University and is corresponding author of the study. He reports, "Conventional wiring technologies rely on rigid conductive materials, which are unsuitable for flexible electronics that need to bend and stretch." There are alternatives to such rigid mater...